Q: Do you know how many chips can be cut from a single wafer?
A: Depending on the size of the chip, hundreds or even tens of thousands of chips can be cut out.
Only effective chips that meet the design performance and functional requirements can be delivered for use; The proportion of effective chips to the total number of chips on a wafer is called yield.
Due to the complex production process of semiconductor products, any errors in the process may lead to a large number of substandard product quality and have a significant impact on the performance of terminal application products.
Therefore, testing probes are particularly important for the production of semiconductor products, running through the entire process of semiconductor product design, manufacturing, packaging testing, and application.
·Semiconductor testing probe·
Semiconductor testing probes are generally formed by three basic components: a needle, a needle tube, and a spring, which are riveted and pre pressed with precision instruments. Due to the extremely small size of semiconductor products, the size requirements for probes are more stringent, reaching the micrometer level.
During chip testing, probes are generally used for precise connections between chip pins or solder balls and the testing machine to achieve signal transmission and detect product qualityConduction, current, function, and agingPerformance indicators such as situation.
The appearance of probes for different purposes may vary, but the probes have a precision spring structure inside. The surface of the product is generally gold-plated, which has strong corrosion resistance, electrical performance, stability, and durability.
As a key component in semiconductor testing equipment,The structure, material, and elasticity of the probeThe stability and signal transduction accuracy of the probe are all affected by factors such as equivalence, which in turn affects the testing accuracy of the probe.
·The importance of semiconductor testing probes·
Semiconductor testing probes are mainly used in chip design verification, wafer testing, and finished product testing. They are the core components that connect chips, wafers, and testing equipment for signal transmission. By using them in conjunction with testing machines, sorting machines, and probe stations, they screen out design defects and manufacturing defective products. They have important value in ensuring product yield, controlling costs, guiding chip design and process improvement, and other aspects. The quality control of semiconductor products plays an important role. The quality of semiconductor products has a significant impact on their testing effectiveness, production efficiency, and cost control.
·The use of probes in finished product testing·
Finished product testing, also known as final testing, refers toPerform functional and electrical parameter testing on the packaged chip,Ensure that the functionality and performance indicators of each chip produced meet the design specifications.
The testing process requires the coordination of a sorting machine and a testing machine. The sorting machine automatically transfers the tested chips one by one to the testing station, and the pins of the tested chips are connected to the functional modules of the testing machine through probes installed on the testing seat.
The testing machine applies input signals to the chip and collects output signals to determine whether the chip's functionality and performance meet the design specifications.
The test results are transmitted to the sorting machine through a communication interface, and the sorting machine marks, sorts, receives or encodes the test chip based on this.
centalic has been committed to the development of domestic probes and insists on independent research and development of high-quality test probes, adhering to independent research and development of high-quality testing probes, using advanced material structures, lean coating treatment, and high-quality assembly technology. To provide customers with the highest quality probe products, this type of semiconductor high-frequency needle requires the smallest needle tip that can be processed firstФ：0.06mmNeedle tubeФ： 0.10mm.
