Time:2024-12-02Reading:983Second
Kuai Technology reported on November 30th that Apple will mass produce the M5 chip by the end of 2025, and TSMC has already received an order from Apple.
It is reported that the Apple M5 chip is built on TSMC's advanced 3nm process, and Apple is not in a hurry to adopt the 2nm process, mainly due to cost considerations.
The report points out that the Apple M5 will adopt TSMC's latest SoIC packaging technology for the first time. It is understood that SoIC is called System Level Integrated Single Chip in Chinese.
As part of TSMC's advanced packaging technology portfolio 3D Fabric, TSMC's SoIC is the industry's first high-density 3D chiplet stacking technology. SoIC design creates bonding interfaces that allow chips to be directly stacked on top of each other.
It is worth noting that TSMC SoIC has started small-scale trial production in July this year, with an expected production capacity of 1900 pieces by the end of this year, and is expected to exceed 3000 pieces next year, an increase of nearly 60%. The production capacity in 2027 is about 3.7 times the level at the end of this year, with a compound annual growth rate of nearly 40%.
The first batch of Apple devices equipped with M5 chips are being prepared intensively, including iPad Pro, MacBook Pro, MacBook Air, and the all-new Vision Pro.
In addition, Apple plans to deploy the M5 chip on AI servers to enhance its AI cloud service capabilities.
