Kuai Technology reported on November 24th that in today's gaming CPU market, AMD is thriving with its X3D series, and the latest release of the 9800X3D is also a hot product that requires a premium purchase on second-hand platforms.

According to media reports, AMD recently submitted a new patent showcasing a possible future "multi chip stacking" technology that achieves compact chip stacking and interconnection by partially overlapping chips.

According to reports, AMD's new method will reduce the physical distance between components through overlapping small chips, minimize interconnect latency, and achieve faster communication between different chip parts.

And it can also improve the efficiency of the contact area, freeing up space for more cores, larger cache, and increased memory bandwidth, thereby achieving significant performance improvements within the same chip size.

This design will also improve power management, as separate small chips allow for better control of each unit through power gating.